This subject aims to train students with the fundamental knowledge of microelectronic and power electronic packaging technologies, including concepts, electrical design, structural & thermal design, material selection, process development, test and failure analysis, with the focus on the understanding of mainstream packaging technologies for high-power & high-frequency related applications. Tutorials can be arranged to ensure the students with hand-on experience on the mainstream design software and understand the fabrication process of electronic packages/modules in industry.The content of this course is composed of seven parts: 1) Mainstream microelectronics packaging format & process; 2) Mainstream power electronics packaging format & process; 3) Fundamentals of thermal management, mechanics & reliability; 4) Electrical, thermal and mechanical co-design considerations with case studies; 5) Modelling and simulation of mainstream electronic packages; 6) Chiplet design and heterogeneous integration packaging; 7) Techniques for failure analysis.